Mitigating Foreign Object Debris in the SMT and PCBA Sector

Teknek, a leader in contamination control technology, is proud to unveil its groundbreaking solutions to address the rising concerns of Foreign Object Debris (FOD) in the Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) sector. Our industry experts, explore the critical importance of clean boards and the integration of contact cleaning technology in a newly released white paper.